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Yu-Te Liaw, Bing-Chuan Bai and James C. M. Li
Department of Electrical Engineering
National Taiwan University
Taipei, 106 Taiwan
E-mail: cmli@cc.ee.ntu.edu.tw
A two-level test data compression technique is presented to reduce both the test data
and the test time for System on a Chip (SOC). The level one compression is achieved by
Huffman coding for the entire SOC. The level two compression is achieved by broadcasting
test patterns to multiple cores simultaneously. Experiments on the d695 benchmark
SOC show that the test data and test time are reduced by 64% and 35%, respectively.
This technique requires no change of cores and hence provides a feasible SOC
test compaction solution for the SOC integrators.
Received June 27, 2006; revised October 2, 2006 & February 7 & May 21, 2007; accepted June 26, 2007.
Communicated by Liang-Gee Chen.
*This research was partly supported by the National Science Council of Taiwan, R.O.C. under contract No.
NSC 92-2220-E-002-006 and by the Ministry of Economy under the contract No. MOE 94-EC-17-A-01-S1-
031.