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<div align="left" style="font-size:16pt;color:#005d2e"><b>三建產業資訊「產學研講座」/</b>

        <span style="font-size:10pt;color:#005d2e">專業技術培訓課程 (工業材料/LED照明/觸控面板/植物工廠/光電半導體/科技企管)</span></div>

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<div align="right" style="font-size: 10pt; color:#000000"><b>【敬請轉寄予您周遭所需知朋友同事人資部門】</b><br/></div>

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  <tr height="40"><td><b><font size="3">企業/團體<br/>內訓/包班</font></b></td></tr>
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    <td><div align="left" style="font-size:10pt;color:#666666">企業內部訓練<b>課程量身定制安排靈活</b>、<b>有效提昇整體素質</b>、<b>增進員工歸屬感且人均成本低</b>,是公司團體間普遍採用的培訓方案。<div> </td>
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  <tr height="40"><td><font size="3" color="#FF0000"><b>短期教育訓練優惠方案</b></font></td></tr>
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    <td><div align="left" style="font-size:10pt;color:#666666">替企業人資部門<b>節省教育訓練預算</b>,提高人數參訓,以達到教育訓練最大成效,在6-10個月內參訓13-28人次即符合優惠資格。<div> </td>
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  <tr height="40"><td><b><font size="3">日本專家內訓<br/>日本技術顧問</font></b></td></tr>

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  <tr height="30"><td><b><font size="3">植物工廠</font></b></td></tr>
  <tr height="20"><td><div style="text-align: left;text-decoration: none"><a target="_blank" href="http://www.sumken.com/tw/eventDetail.do?parameter=OH27032014">水耕型植物工廠栽培系統環境(台北)(3/27)</a></div></td></tr>
  <tr height="20"><td><div style="text-align: left;text-decoration: none"><a target="_blank" href="http://www.sumken.com/tw/eventDetail.do?parameter=OH28032014"><b><font size="2" color="#FF0000">熱門-</font></b>具備高經濟價植的植物工廠發展思路(台北)(3/28)</a></div></td></tr>
  <tr height="20"><td><div style="text-align: left;text-decoration: none"><a target="_blank" href="http://www.sumken.com/tw/eventDetail.do?parameter=OH02042014">水耕型植物工廠栽培系統環境(台南)(4/2)</a></div></td></tr>
  <tr height="20"><td><div style="text-align: left;text-decoration: none"><a target="_blank" href="http://www.sumken.com/tw/eventDetail.do?parameter=OH03042014">具備高經濟價植的植物工廠發展思路(台南)(4/3)</a></div></td></tr>
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  <tr height="30"><td><b><font size="3">LED照明</font></b></td></tr>
  <tr height="20"><td><div style="text-align: left;text-decoration: none"><a target="_blank" href="http://www.sumken.com/tw/eventDetail.do?parameter=OH25032014"><b><font size="2" color="#FF0000">焦點-</font></b>兩岸LED照明封裝技術探討課題(3/25)</a></div></td></tr>
  <tr height="20"><td><div style="text-align: left;text-decoration: none"><a target="_blank" href="http://www.sumken.com/tw/eventDetail.do?parameter=OH26032014">最新LED共晶EMC封裝技術因應課題(3/26)</a></div></td></tr>
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  <tr height="30"><td><b><font size="3">觸控面板</font></b></td></tr>
  <tr height="20"><td><div style="text-align: left;text-decoration: none"><a target="_blank" href="http://www.sumken.com/tw/eventDetail.do?parameter=OH17042014"><b><font size="2" color="#FF0000">本週NEW-</font></b>現階段觸控結構與R2R製程發展課題(4/17)</a></div></td></tr>
  <tr><td><div style="text-align: left;text-decoration: none"><a target="_blank" href="http://www.sumken.com/tw/eventDetail.do?parameter=OH18042014">觸控銀奈米線應用與金屬網格課題(4/18)</a></div></td></tr>
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  <tr height="30"><td><b><font size="3">科技企管</font></b></td></tr>
  <tr height="20"><td><div style="text-align: left;text-decoration: none"><a target="_blank" href="http://www.sumken.com/tw/eventDetail.do?parameter=OH23042014">工作效率與績效評估(4/23)</a></div></td></tr>
  
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  <tr height="30"><td><b><font size="3">光電半導體</font></b></td></tr>
  <tr height="20"><td><div style="text-align: left;text-decoration: none"><a target="_blank" href="http://www.sumken.com/tw/eventDetail.do?parameter=OH26022014"><b><font size="2" color="#FF0000">~最後1天~</font></b>智慧穿戴科技產品應用市場技術動向(2/26)</a></div></td></tr>
  <tr height="20"><td><div style="text-align: left;text-decoration: none"><a target="_blank" href="http://www.sumken.com/tw/eventDetail.do?parameter=OH06032014">3D列印商業化應用與個案介紹(3/6)</a></div></td></tr>
  <tr height="20"><td><div style="text-align: left;text-decoration: none"><a target="_blank" href="http://www.sumken.com/tw/eventDetail.do?parameter=OH07032014">先進雷射積體製造系統與成型材料課題(3/7)</a></div></td></tr>
  <tr height="20"><td><div style="text-align: left;text-decoration: none"><a target="_blank" href="http://www.sumken.com/tw/eventDetail.do?parameter=OH25042014">高解析度CMOS影像感測技術動向(4/25)</a></div></td></tr>
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  <tr height="30"><td><b><font size="3">工業材料</font></b></td></tr>
  <tr height="20"><td><div style="text-align: left;text-decoration: none"><a target="_blank" href="http://www.sumken.com/tw/eventDetail.do?parameter=OH10012014">最新奈米金屬應用材料技術開發動向(4/11)</a></div></td></tr>
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       <font color="#0000FF"><b>~~以上請留意「早鳥優惠」報名日期;相約同事好友/兩人報名享9折優惠(同一人報名2場次亦同)~~
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                                  <b><font size="4">兩岸LED照明封裝技術探討課題</font></b>
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                                <td>詳細</td>
                                <td>複製連結<br/>http://www.sumken.com/tw/eventDetail.do?parameter=OH25032014
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                                <td>日期</td>
                                <td>2014.3.25(二) 9:30-16:30</td>
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                                        <font color="#000000"><b>(一)台灣LED封裝技術發展趨勢</b></font><br/>
                                        <font size="2">.COB製程<br/>.高功率封裝</font>
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                                      <td align="center"><font size="2">意見交流</font></td>
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                                        <font color="#000000"><b>(二)LED封裝與檢測技術的新動向 </b></font><br/><br/>
                                        <font size="2">.LED倒扣芯片與共晶焊<br/>.LED晶圓級封裝<br/>.LED可靠性檢測與失效分析</font>
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                                        <font size="2" color="#000000">
<b>李世瑋</b>/香港科技大學 教授 <br/></font>
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專攻晶圓級和三維微系統封裝、LED封裝和半導體照明技術、無鉛焊接技術與焊點可靠性,經常受邀於中國大陸的技術研討會,是大陸LED領域相當知名的權威專家,去年初當選IEEE CPMT全球總裁,曾任香港科大NAMI技術總監;IEEE電子元件及封裝技術期刊總主編;IEEE CPMT傑出講師;英國物理學會、美國機械工程師學會評選為學會會士
                                        
                                        
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                                      <td align="center"><font size="2">意見交流</font></td>
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                                  <b><font size="4">最新LED共晶EMC封裝技術因應課題</font></b>
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                                <td>詳細</td>
                                <td>複製連結<br/>http://www.sumken.com/tw/eventDetail.do?parameter=OH26032014
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                                <td>日期</td>
                                <td>2014.3.26(三) 9:30-16:30</td>
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                                        <font color="#000000"><b>(一)LED EMC封裝應用市場發展</b></font><br/>      
<font size="2">
.中高功率EMC封裝市場應用概況<br/>
.EMC產品成本與性價比<br/>
.對相關支架、設備廠商的影響<br/>
.對傳統PPA和陶瓷支架的衝擊</font>
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                                        <font color="#000000"><b>(二)共晶EMC封裝技術動向 </b></font><br/>
                                        <font size="2">
                                        
.封裝材料的演進與差異<br/>
.EMC封裝製程解析<br/>
.EMC、PPA與PCT支架材料解析<br/>
.導入問題與克服</font>
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                                      <td align="center"><font size="2">意見交流</font></td>
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          <td><b>洽詢報名</b></td>
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          <td><div align="left" style="color:#005d2e">TEL:(02)2536-4647 林小姐<br/>FAX:(02)2536-1072<br/>E-mail:inform@sumken.com</div></td>
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          <td><b>報名方式</b></td>
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1.傳真報名:請下載報名表後填寫,傳真回本單位。<br/>
2.網路報名:進入個別課程網頁的報名系統
          
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          <td><b>匯款資料</b></td>
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【匯款、ATM】<br/>
受款帳戶:三建資訊有限公司<br/>
受款銀行:國泰世華(013)松江分行<br/>
受款帳號:0 2 8 - 0 3 - 5 0 0 2 0 7 - 5<br/>
【支票、匯票】<br/>
郵寄:104台北市中山區吉林路245號7樓<br/>
支票抬頭:三建資訊有限公司
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<div align="right" style="font-size: 10pt"><a href="mailto:inform@sumken.com"><span style="text-decoration: none">如您不願收到此通知訊息,敬請來電或來信取消,造成不便,敬請見諒</span></a></div>
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三建產業資訊 台北市中山區吉林路245號7樓
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