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        <font color="#FFFFFF">※三建產業情報社:
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                      <td colspan="2"><font color="#FF0000"><b>《東京訪團&觀展》</b></font><br></td>
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                      <td></td>
                      <td>.<a target="_blank" 

href="http://www.sumken.com/ch/insides/inside181209.html"><span style="background-color: #FFFF00">日

本5G材料訪察暨FINETECH、SEMICON觀展團</span></a>(12月)東京</td>
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                  <font color="#FF0000" size="3"><b>【10/24新竹】</b></font>
                  <span style="font-weight: 700; background-color: #FFFF00; font-size:24px"><a 

target="_blank" href="http://www.sumken.com/ch/insides/inside181026.html">【日本專家】高速FPC用電解

銅箔開發動向與高周波特性</a></span><br>
                     
                  <font size="4">針對用於高速FPC表面處理、並具有壓延銅箔折疊特性的電解銅箔來進行解說

。<br>
<strong>一、【高速FPC用電解銅箔開發的概要】</strong><br>
.由基底銅箔低粗糙度來探討<br>
.由表面處理來探討<br>
<strong>二、【電解銅箔低粗糙化的開發】</strong><br> 
.關於銅箔結晶<br>
.FPC用低粗糙度電解銅箔的開發<br>
<strong>三、【高速用表面處理的開發】</strong><br> 
.關於表面處理的粒子<br>
.高速用表面處理的開發<br>
<strong>四、【高速FPC用電解銅箔的傳輸特性】</strong><br> 
.傳輸特性<br>
.和壓延銅箔的比較<br>
<strong>五、【高速FPC用電解銅箔的折疊特性】</strong><br> 
.關於折疊測試設備<br>
.和壓延銅箔的比較<br>
<a target="_blank" href="http://www.sumken.com/ch/insides/inside181026.html">(活動詳情)</a>
<a target="_blank" href="http://www.sumken.com/tw/onlinesignstep01.do?sid=OH26102018">(線上報名)</a>
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size:12pt">
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                                                <span style="background-color: #FFFF00">《近期活動一

覽表》

</span></b></font><br></td>
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                      <td>.<b><font color="#FF0000">【東京訪團&觀展】</font></b><a target="_blank" 

href="http://www.sumken.com/ch/insides/inside181209.html">日本5G材料訪察暨FINETECH、SEMICON觀展團

</a>(12月)東京</td>
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                      <td>.<b><font color="#FF0000">【磁性材料】</font></b><a target="_blank" 

href="http://www.sumken.com/ch/insides/inside181009.html">最新磁阻式記憶體 (MRAM) 技術發展</a>(10/9)

台北</td>
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                      <td>.<b><font color="#FF0000">【QLED】</font></b><a target="_blank" 

href="http://www.sumken.com/ch/insides/inside181018.html">邁向無鎘化QLED技術挑戰與關鍵動向</a>

(10/18)台北</td>
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                      <td>.<b><font color="#FF0000">【日本專家】</font></b><a target="_blank" 

href="http://www.sumken.com/ch/insides/inside181026.html">高速FPC用電解銅箔的開發動向和其高頻特性

</a>(10/24)新竹</td>
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size:12pt">
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                                                <span style="background-color: #FFFF00">《日本技術書

籍》
</span></b></font><br></td>
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                      <td>【2018.9預購中】<a target="_blank" 

href="http://www.sumken.com/ch/books1.html">針對電漿CVD最適當化成膜條件所需之反應機制的理解及其製程

的管理‧成膜事例</a></td>
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                      <td></td>
                      <td>【2018.6】<a target="_blank" href="http://www.sumken.com/ch/books3.html">

量產化Micro LED製造技術動向</a></td>
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                      <td width="2%"></td>
                      <td width="98%">【2015.9】<a target="_blank" 

href="http://www.sumken.com/ch/books3.html">塗布型透明導電膜的材料開發和成膜.Pattern形成技術

</a></td>
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                      <td width="2%"></td>
                      <td width="98%">【2017.7】<a target="_blank" 

href="http://www.sumken.com/ch/books1.html"><樹脂-金屬.陶瓷.玻璃.橡膠> 異種材料黏接/接合技術

</a></td>
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                      <td width="2%"></td>
                      <td width="98%">【2016.2】<a target="_blank" 

href="http://www.sumken.com/ch/books1.html">微粒子研磨液的分散.凝結狀態與分散安定性的評價</a></td>
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                      <td width="2%"></td>
                      <td width="98%">【2014.7】<a target="_blank" 

href="http://www.sumken.com/ch/books1.html">印刷電子用導電性(奈米)墨水的設計開發和製程最佳化

</a></td>
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