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<title>【前瞻系列!】★高速5G雜訊材料對策及電磁波屏蔽/吸收★薄層FO封裝材料觀點(RDL/Coreless子基板) </title>
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  <strong><span style="font-size:18px;font-family:微軟正黑體;"><span style="background-color:#ff8c00;"> 焦點快報 </span></span></strong>
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    ◆<font color="#008000"><strong>薄層FO封裝材料觀點(RDL/Coreless)</strong></font>
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    ◆<font color="#008000"><strong>高速5G雜訊材料對策</strong></font>
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    ◆<font color="#008000"><strong>高機能LCP材料設計</strong></font>
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    ◆<font color="#008000"><strong>聚醯亞胺/二氧化矽「均勻化」分散</strong></font>
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  <span style="font-size:16px;font-family:微軟正黑體;">
    ◆<font color="#008000"><strong>毫米波5G材料評價技術</strong></font>
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    ◆<font color="#008000"><strong>無鎘QD材料合成、噴墨印刷OLED、摺疊顯示、微粒子表面處理</strong></font>
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  <strong><span style="font-size:18px;font-family:微軟正黑體;"><span style="background-color:#ff8c00;"> 《前瞻系列課程》 </span></span></strong>
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<strong>
<span style="font-size:16px;font-family:微軟正黑體"> ★8月13、14日/台北<span style="background-color:#FD5454;">【工業局補助!確定開課】</span></span><br/>     
<span style="font-size:20px;font-family:微軟正黑體">
 <a style="text-decoration:underline; font-weight:bold; color:#0000FF" target="_blank" href="http://www.sumken.com/ch/insides/inside190813.html">【日本專家】半導體薄層FO封裝材料觀點(RDL/Coreless子基板)</a>  </span>
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<div> <span style="font-size:14px;font-family:微軟正黑體;">   本課題針對「薄層接線迴路實用化的重要關鍵-再接線及無心(coreless)化」特別詳細說明。<br/>
<strong>第3章「薄層封裝(FO型PKG)的開發」</strong>:(1)FOWLP實用化(2)扇出型封裝對策(3)薄層接線迴路(RDL/coreless)<br/>
<strong>第4章「薄層接線迴路的課題」</strong>:(1)RDL韌化、coreless薄層化(2)薄層封裝方式(3)薄層封裝材料(微細二氧化矽分散/樹脂高機能化/觸媒活性制御)<br/>
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    <a style="text-decoration:none; font-weight:bold; font-size:16px;" target="_blank" href="http://www.sumken.com/ch/insides/images/190813Pre-FOPKG.pdf">(~~講義試讀~~)</a>| 
        <a style="text-decoration:none; font-weight:bold; font-size:16px;" target="_blank" href="http://www.sumken.com/ch/insides/inside190813.html">(~~查看詳情~~)</a>| 
        <a style="text-decoration:none; font-weight:bold; font-size:16px;" target="_blank" href="http://www.sumken.com/tw/onlinesignstep01.do?sid=OH13082019">(~~線上報名~~)</a> 
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<strong>
<span style="font-size:16px;font-family:微軟正黑體"> ★8月15、16日/台北<span style="background-color:#FD5454;">【工業局補助!最後9名額】</span></span><br/>    
<span style="font-size:20px;font-family:微軟正黑體">
 <a style="text-decoration:underline; font-weight:bold; color:#0000FF" target="_blank" href="http://www.sumken.com/ch/insides/inside190815.html">【日本專家】邁向5G時代的半導體封裝最新動向~符合高速通訊的雜訊對策-材料技術~</a>  </span>
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<div> <span style="font-size:14px;font-family:微軟正黑體;">   半導體CPS化演進。處理時間的極限速度從「晶片內」轉變成「晶片之間」。也就是說,轉移至縮短接線迴路的距離。今後的高速化不只有雜訊對策,接線迴路的「短距離化」也是考慮因素。<br/>
<strong>第2章「通訊裝置的雜訊對策與電磁波屏蔽?電磁波吸收材」</strong><br/>
(1)外部雜訊:屏蔽(EMS)、電磁波吸收(EMA)、EMS/EMA材料<br/>
(2)?部雜訊:EMA 、降低電磁誘導、去除雜訊(濾波器);SAW/BAW, SAW材料(薄片)<br/> 
(3)介電性質:電容率(ε)、損耗正切(tanδ)、介電性質的影響(速度/損失)、低介電係數材料<br/>
(4)除去雜訊:除去方法、SAW濾波器用封裝材料(薄板)<br/>
<strong>第3章「符合通訊裝置的高速化對策的材料技術」</strong><br/>
(1)傳輸接收部;小型化(IC化,高密度實裝)<br/>
(2)資訊處理部;縮短傳輸距離(FO-PKG+回路接線薄層化)<br/>
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    <a style="text-decoration:none; font-weight:bold; font-size:16px;" target="_blank" href="http://www.sumken.com/ch/insides/images/190815Pre-5G.pdf">(~~講義試讀~~)</a>| 
        <a style="text-decoration:none; font-weight:bold; font-size:16px;" target="_blank" href="http://www.sumken.com/ch/insides/inside190815.html">(~~查看詳情~~)</a>| 
        <a style="text-decoration:none; font-weight:bold; font-size:16px;" target="_blank" href="http://www.sumken.com/tw/onlinesignstep01.do?sid=OH15082019">(~~線上報名~~)</a> 
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<strong>
<span style="font-size:16px;font-family:微軟正黑體"> ★8月30日/台北<span style="color:#FF0000;">【Touch Taiwan展覽會!同期課程】</span></span><br/>       
<span style="font-size:20px;font-family:微軟正黑體">
 <a style="text-decoration:underline; font-weight:bold; color:#0000FF" target="_blank" href="http://www.sumken.com/ch/insides/inside190830.html">【日本專家】液晶LCP材料設計及各種應用~朝向高耐熱.高機能化課題~</a>  </span>
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<div> <span style="font-size:14px;font-family:微軟正黑體;">   近年來,由於LCP具有低介電常數,低介質損耗角正切特性的架構,所以作?適用於5G的材料而備受矚目。本課題將介紹LCP材料設計,及從材料選擇上而達到最大限度利用其特點,並提出注塑方法和應用實例。<br/>
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        <a style="text-decoration:none; font-weight:bold; font-size:16px;" target="_blank" href="http://www.sumken.com/ch/insides/inside190830.html">(~~查看詳情~~)</a>| 
        <a style="text-decoration:none; font-weight:bold; font-size:16px;" target="_blank" href="http://www.sumken.com/tw/onlinesignstep01.do?sid=OH30082019">(~~線上報名~~)</a> 
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<strong>
<span style="font-size:16px;font-family:微軟正黑體"> ★9月11、12日/新竹<span style="background-color:#FD5454;">【新課推薦!】</span></span><br/>    
<span style="font-size:20px;font-family:微軟正黑體">
 <a style="text-decoration:underline; font-weight:bold; color:#0000FF" target="_blank" href="http://www.sumken.com/ch/insides/inside190911.html">【日本專家】聚醯亞胺/二氧化矽混合材料的透明度及奈米二氧化矽的分散技術</a>  </span>
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<div> <span style="font-size:14px;font-family:微軟正黑體;">   兩者材料混合時為達成「均勻化」分散目的,使用矽烷偶聯劑來補充相溶性,從而改善兩者的混合性,因此可取得維持「透明度」的聚醯亞胺/矽石混合材料。本課題將針對製造環境條件、所製成混合材料之特性來做說明。<br/>
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        <a style="text-decoration:none; font-weight:bold; font-size:16px;" target="_blank" href="http://www.sumken.com/ch/insides/inside190911.html">(~~查看詳情~~)</a>| 
        <a style="text-decoration:none; font-weight:bold; font-size:16px;" target="_blank" href="http://www.sumken.com/tw/onlinesignstep01.do?sid=OH11092019">(~~線上報名~~)</a> 
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<strong>
<span style="font-size:16px;font-family:微軟正黑體"> ★10月2、3日/台北<span style="background-color:#FD5454;">【新課推薦!以日本材料評價技術為主】</span></span><br/>    
<span style="font-size:20px;font-family:微軟正黑體">
 <a style="text-decoration:underline; font-weight:bold; color:#0000FF" target="_blank" href="http://www.sumken.com/ch/insides/inside191002.html">【日本專家】次世代毫米波5G系統及材料評價技術</a>  </span>
</strong>
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<div> <span style="font-size:14px;font-family:微軟正黑體;">   本課題以「毫米波應用市場趨勢及挑戰」為方向,邀集台日專家共同探討亳米波材料評價、亳米波材料塗佈及製作、亳米波電路設計等完整課題。請勿錯過。<br/>
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        <a style="text-decoration:none; font-weight:bold; font-size:16px;" target="_blank" href="http://www.sumken.com/ch/insides/inside191002.html">(~~查看詳情~~)</a>| 
        <a style="text-decoration:none; font-weight:bold; font-size:16px;" target="_blank" href="http://www.sumken.com/tw/onlinesignstep01.do?sid=OH02102019">(~~線上報名~~)</a> 
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<strong>
<span style="font-size:16px;font-family:微軟正黑體"> ★9月17日/新竹<span style="color:#FF0000;">【僅此一檔】</span></span><br/>       
<span style="font-size:20px;font-family:微軟正黑體">
 <a style="text-decoration:underline; font-weight:bold; color:#0000FF" target="_blank" href="http://www.sumken.com/ch/insides/inside190917.html">【日本專家】無鎘量子點的材料、合成、特性及其應用</a>  </span>
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<div> <span style="font-size:14px;font-family:微軟正黑體;">   配備有CdSe量子點螢光粉和InP量子點螢光粉的QLED已經上市。本課題透過易懂方式介紹量子點合成技術、鎘使用規定的趨勢、無鎘量子點材料的現狀,以及各種發光元素的應用在世界上最新的趨勢。<br/>
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        <a style="text-decoration:none; font-weight:bold; font-size:16px;" target="_blank" href="http://www.sumken.com/ch/insides/inside190917.html">(~~查看詳情~~)</a>| 
        <a style="text-decoration:none; font-weight:bold; font-size:16px;" target="_blank" href="http://www.sumken.com/tw/onlinesignstep01.do?sid=OH17092019">(~~線上報名~~)</a> 
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<div> <strong><span style="font-size:18px;font-family:微軟正黑體;"><span style="background-color:#ff8c00;"> 如何報名 </span></span></strong> </div>
<div> <span style="font-size:16px;font-family:微軟正黑體;"> <strong>◆洽詢報名:</strong>(02)2536-4647#10張小姐、電郵信箱sumken@sum-ken.com </span> </div>
<div> <span style="font-size:16px;font-family:微軟正黑體;"> <strong>◆報名優惠:</strong>依各場次公告網頁為準。
<strong>※ 【多人報名】不限於相同單位,全享優惠價※ </strong></span>
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<div> <span style="font-size:16px;font-family:微軟正黑體;"> <strong>◆繳款資訊:</strong>依各場次公告網頁為準。</span> </div>
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  <strong><span style="font-size:18px;font-family:微軟正黑體;"><span style="background-color:#ff8c00;"> 《材料、顯示系列課程》 </span></span></strong>
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  <span style="font-size:16px;font-family:微軟正黑體;">
    ★<strong>2019年7月24日,新竹<span style="color:#FF0000;">【確定開課!】</span></strong><a style="text-decoration:none; font-weight:bold; " target="_blank" href="http://www.sumken.com/tw/onlinesignstep01.do?sid=OH24072019">(網路報名)</a><br/>
    <a style="text-decoration:none; font-weight:bold; " target="_blank" href="http://www.sumken.com/ch/insides/inside190724.html"><font size="3">【日本專家】新世代噴墨印刷式OLED技術課題</font></a>
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  <span style="font-size:16px;font-family:微軟正黑體;">
    ★<strong>2019年10月2、3日,台北<span style="color:#FF0000;">【工業局補助!最後7名額】</span></strong><a style="text-decoration:none; font-weight:bold; " target="_blank" href="http://www.sumken.com/tw/onlinesignstep01.do?sid=OH09052019">(網路報名)</a><br/>
    <a style="text-decoration:none; font-weight:bold; " target="_blank" href="http://www.sumken.com/ch/insides/inside190509.html"><font size="3">【日本專家】次世代摺疊顯示的最新技術動向~各式可撓曲化顯示技術解析~</font></a>
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  <span style="font-size:16px;font-family:微軟正黑體;">
    ★<strong>2019年10月15日,新竹<span style="color:#FF0000;">【確定開課!受航空罷工影響改期】</span></strong><a style="text-decoration:none; font-weight:bold; " target="_blank" href="http://www.sumken.com/tw/onlinesignstep01.do?sid=OH25062019">(網路報名)</a><br/>
    <a style="text-decoration:none; font-weight:bold; " target="_blank" href="http://www.sumken.com/ch/insides/inside190625.html"><font size="3">【日本專家】粉體.微粒子的表面處理及機能性奈米塗佈技術</font></a>
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  <span style="font-size:16px;font-family:微軟正黑體;">
    ★<strong>2020年2月19、20日,新竹</strong><a style="text-decoration:none; font-weight:bold; " target="_blank" href="http://www.sumken.com/tw/onlinesignstep01.do?sid=OH23072019">(網路報名)</a><br/>
    <a style="text-decoration:none; font-weight:bold; " target="_blank" href="http://www.sumken.com/ch/insides/inside190723.html"><font size="3">【日本專家】環氧樹脂用硬化劑.硬化物的分析技術</font></a>
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