[Most-ai-contest] submit your technical reports before 4/20 (Monday)

[廖沛俊]

范博士您好 

Single Span Module的Technical Report如附件 

廖沛俊 敬上 


寄件者: "simonc" <simonc at iis.sinica.edu.tw> 
收件者: "范正忠" <jjfan at iis.sinica.edu.tw> 
副本: "Most-ai-contest" <Most-ai-contest at iis.sinica.edu.tw> 
寄件備份: 2020 4 月 20 星期一 上午 8:58:23 
主旨: Re: [Most-ai-contest] submit your technical reports before 4/20 (Monday) 

Dear Dr. Fan, 

Attached please find the technical report for the single-span-multi-hop-module. 

Regards, 
張光瑜 



寄件者: "范正忠" <jjfan at iis.sinica.edu.tw> 
收件者: "kysu" <kysu at iis.sinica.edu.tw> 
副本: "Most-ai Contest" <Most-ai-contest at iis.sinica.edu.tw> 
寄件備份: 2020 4 月 14 星期二 上午 8:26:39 
主旨: [Most-ai-contest] submit your technical reports before 4/20 (Monday) 

Dear all, 

Please remember to submit your technical report to me about your module design and implementation before 4/20. 
Thanks again for your help. 

Best, 
jjfan 

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