[Most-ai-contest] submit your technical reports before 4/20 (Monday)

[闍怵羅]

各位好，
我是Multi-SPan Extraction Module的負責人-羅上堡，
附件為多段落提取模型的中文技術報告。

羅上堡，敬上。

廖沛俊 <newsboy3423 at iis.sinica.edu.tw> 於 2020年4月20日 週一 下午3:38寫道：

> 范博士您好
>
> Single Span Module的Technical Report如附件
>
> 廖沛俊 敬上
>
> ------------------------------
> *寄件者: *"simonc" <simonc at iis.sinica.edu.tw>
> *收件者: *"范正忠" <jjfan at iis.sinica.edu.tw>
> *副本: *"Most-ai-contest" <Most-ai-contest at iis.sinica.edu.tw>
> *寄件備份: *2020 4 月 20 星期一 上午 8:58:23
> *主旨: *Re: [Most-ai-contest] submit your technical reports before 4/20
> (Monday)
>
> Dear Dr. Fan,
>
> Attached please find the technical report for the
> single-span-multi-hop-module.
>
> Regards,
> 張光瑜
>
>
> ------------------------------
> *寄件者: *"范正忠" <jjfan at iis.sinica.edu.tw>
> *收件者: *"kysu" <kysu at iis.sinica.edu.tw>
> *副本: *"Most-ai Contest" <Most-ai-contest at iis.sinica.edu.tw>
> *寄件備份: *2020 4 月 14 星期二 上午 8:26:39
> *主旨: *[Most-ai-contest] submit your technical reports before 4/20 (Monday)
>
> Dear all,
>
> Please remember to submit your technical report to me about your module
> design and implementation before 4/20.
> Thanks again for your help.
>
> Best,
> jjfan
>
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